level 1
azjq529
楼主
MEMORY MODULE
Manufacturer
Kingston
Series
Not determined
Part Number
KF3600C17D4/8GX
Serial Number
B8B72C93h
JEDEC DIMM Label
8GB 1Rx8 PC4-2400T-UA3-11
Architecture
DDR4 SDRAM UDIMM
Speed Grade
DDR4-2400T downbin
Capacity
8 GB (8 components)
Organization
1024M x64 (1 rank)
Register Model
N/A
Manufacturing Date
Sep 27 - Oct 1 / Week 39, 2021
Manufacturing Location
Taiwan
Revision / Raw Card
FF00h / A3 (8 layers)
DRAM COMPONENTS
Manufacturer
Hynix
Part Number
H5AN8G8NDJR-UHC
Package
Standard Monolithic 78-ball FBGA
Die Density / Count
8 Gb D-die (Davinci / 17 nm) / 1 die
Composition
1024Mb x8 (64Mb x8 x 16 banks)
Clock Frequency
1200 MHz (0.833 ns)
Minimum Timing Delays
17-17-17-39-55
Read Latencies Supported
18T, 17T, 16T, 15T, 14T, 13T, 12T...
Supply Voltage
1.20 V
XMP Certified
1802 MHz / 17-21-21-39-85 / 1.35 V
XMP Extreme
1499 MHz / 15-17-17-36-64 / 1.35 V
SPD Revision
1.1 / September 2015
XMP Revision
2.0 / December 2013
2021年11月05日 22点11分
1
Manufacturer
Kingston
Series
Not determined
Part Number
KF3600C17D4/8GX
Serial Number
B8B72C93h
JEDEC DIMM Label
8GB 1Rx8 PC4-2400T-UA3-11
Architecture
DDR4 SDRAM UDIMM
Speed Grade
DDR4-2400T downbin
Capacity
8 GB (8 components)
Organization
1024M x64 (1 rank)
Register Model
N/A
Manufacturing Date
Sep 27 - Oct 1 / Week 39, 2021
Manufacturing Location
Taiwan
Revision / Raw Card
FF00h / A3 (8 layers)
DRAM COMPONENTS
Manufacturer
Hynix
Part Number
H5AN8G8NDJR-UHC
Package
Standard Monolithic 78-ball FBGA
Die Density / Count
8 Gb D-die (Davinci / 17 nm) / 1 die
Composition
1024Mb x8 (64Mb x8 x 16 banks)
Clock Frequency
1200 MHz (0.833 ns)
Minimum Timing Delays
17-17-17-39-55
Read Latencies Supported
18T, 17T, 16T, 15T, 14T, 13T, 12T...
Supply Voltage
1.20 V
XMP Certified
1802 MHz / 17-21-21-39-85 / 1.35 V
XMP Extreme
1499 MHz / 15-17-17-36-64 / 1.35 V
SPD Revision
1.1 / September 2015
XMP Revision
2.0 / December 2013