吉他老马哥 吉他老马哥
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有需要“洞洞流”ATX箱子的吗?两台长城全塔200出 闲置两台箱子,分别是长城铁幕503B和长城隐刃600B(不带V2)。两箱都是自用没超三个月,配件齐,没变形没掉漆。有需者站内私信。最好广州同城自提(如芳村附近我也可开车送)。 简介下,1,铁幕503B,全0.8钢板,用料扎实。双侧mesh钢板,左侧70%开孔,利于显卡进风量,右侧近硬盘位开孔。双侧板为手拧镙丝安装方式,顶、前都可装360水冷,前可装12X3,14X3或20X2风扇。后出12X1或14X1风扇。稍遗憾的最前置IO是双∪SB2.0十1USB3.0,无TypeC,有点跟不上时代。 2,隐刃600B一代(再次强调不是现在改进的Ⅴ2)。0.8钢板,用料扎实,两侧mesh侧板可互换位置,mesh面积70%以上,侧板安装方式是球扣式,方便拆装。支持显卡竖装,不支持背插(V2支持背插,但强度也降低了)。尺寸几乎与503B一样大,前可装12X3,14X3,20X2或360水冷,顶最大360水或12X3,14X3风扇。但顶部水冷安装位设计稍有缺陷,它是把这个位置完全中置的,而不是像更多品牌将顶部水冷安装位偏左设计。这导致装异形厚排时,冷排风扇与主板顶端的散热片距离较近。好在这箱子够大,安装时注意先装好主板,并插好4十8或8十8CP∪供电线后,再安装顶部水冷前置IO改为2∪SB3.0十1TypeC。 割爱不用这两台箱子的原因是,1是503B前置接口稍老旧,自已常需在前置插∪SB3.0设备,不太够用。2是前段在某东发现隐刃600B出了V2,将顶部水冷位左移,底板还支持背插了,所以现在新买了V2在用。咱在这算比较中肯地评价了长城这两只箱子,有优点(做工用料扎实),也有缺点(设计师不思进取,总有些不走心不过脑的设计)。有心的网友可站内私信我。不喜勿喷。谢谢 图借某东的,前1是503B,后3是600B
纯技术原创贴被无故删除,心情非常不爽!难道这就叫清朗? 4月9日,本人写了篇小文《Rog Strix X570-E官更1408版新Bios,顺聊zen2之CPU超频。》,总结一些zen2 CPU的超频思路。虽然不算什么高手,但文中一字一句都是自己亲自在贴吧页面上敲出来的,配图也是自己跑测试进亲测过测时的截图。小文发出后,也得到不少网友的热情回复、讨论和点赞等。但昨天夜里,突然被百度通知,此文因违规,被系统删除。我非常纳闷,就去服务中心申请恢复,嘿嘿,三次申请,三次被拒,回复都是同样格式的冷冰冰的句子“您好,您发布的内容包含违规信息,所以被系统删除,请您下次注意哦~”。。。。 人,如果犯罪,法官应向其宣布其所犯罪行;报社、杂志投稿,人家也会给出适当理由才退稿,让投稿人明明白白。但,在这里,我三次申请,都希望人工恢复,要求仔细核查我文章中,哪段?哪里有违规问题,请给予明确说明,但每次都得到上述那段冷冰冰的话。 之所以来AMD吧,也是长期以来,看到这里讨论气氛特别好,抱着与广大网友共同学习电脑技术的心态而来的,自己虽然不经常发贴,但每次所发主贴,都是针对热点问题、热点产品,自己有一些使用心得,有感而发的。贴子偶尔因排版、个别用词的问题,被并不是非常智能的“度娘”删除了,没意见,自己以后注意。但像上述该文章,发布了近4个月了,而且依然零星有网友回复或提问,可以说,这贴子是没有问题的,现在被无故拿下,本人真心感觉心寒!
X570-E主板刷Bios的正确姿势 9月10日,苏妈为了避免zen2 PPT的法律纠纷,推出了所谓“鸡血”的AGESA 1.0.0.3 ABBA微代码。微星林大第一时间为微星用户提供了各板的最新Bios,但在说明里也特别强调了新版Bios对3800X及3900X优化明显,而对3700X及以下效果不明显,散热不好的更是没戏。 9月12日,华硕X570-E也终于推出了新Bios 1201版。我这个3700X用户也马上刷新了1201版。但试用后,发现此版bios对3700X来说果然无甚效果。非但如此,还有两处致命的问题:1.内存性能回缩,在未升级前,本人使用1005版Bios(AGESA 1.0.0.3 ABB),一对海盗船内存默认1.35V电压可稳定工作在 3733(1866)上,但升至1201版后,这对内存却回缩至3600(1800)上了。2.Vcore offset - 核心电压减偏移失效。关于通过 offset - 适当调低Vcore电压(动态)的好处,大家应该都知道,可以在动态PBO下,进一步降低温度与功耗,效能好于默认PBO。在原1005版Bios下,X570-E可 offset -0.15V,辅以4级防掉压,效能等效于定频定压4.2G的水平。而此种方式的电压更低,满载温度与功耗也更低。但是,当我升级至1201版Bios后,采用上述同样的设置,却发现常常在低负载甚至待机状态蓝屏或重启!经过好几天的反复试验、琢磨,感觉是新的1.0.0.3 ABBA微代码在搞鬼!怎么搞鬼?AMD在新代码中,将CPU基频开机电压调低了。因为offset模式是全局电压偏移,所以在低负载时,这个偏移量已经不足以撑住系统稳定运行,所以出现各种蓝屏!既然1201版有这样那样的问题,用起来不爽,那回刷Bios不就得了?是的,起初我也这么想的,回刷!在哪刷?当然在Bios里用华硕的 EZflash工具去刷呀!错!这样回刷无效! 为什么?我也是百思不得其解。后来想起微星林大一期视频里讲过AM4平台的开机原理,AMD的AGESA微码的优先权是优于主板Bios的,也就是主板加电后,先交给AGESA来初始化CPU及内存。它完事了才把控制权交给bios。 所以在Bios里回刷旧版Bios,系统已经在Bios之前提前被AGESA码“占领”了!所以这样刷Bios,AGESA码不会回退! 那肿么办?好在X570-E在IO部有一处flashback按钮。我们得用 Flashback来刷Bios!这样就可以在AGESA码控制主板之前,完整地刷入带有旧版AGESA码的旧版Bios了。 具体方法:将旧版bios下载保存至U盘(最好是USB2.0,fat或fat32格式),将文件名改为 SX570EG.CAP ,进Bios F5恢复全默认,F10存退(最好再 cleanCMOS放电一次),然后关机(不拔电源线),将U盘插入 IO部 Flashback 按钮旁边的 USB接口,按住按钮3秒,此外会有个led开始发出微弱的绿光,闪呀闪,U盘也跟着闪,大概1分多钟,当led灯灭了后,大功告成!通过上述方法,我成功回退至1005版,写此贴时,正是用 offset -0.15V,4级防掉压的方式在工作,未出现任何异状
用华硕 Strix X570-E的朋友进来交流一下 说好了不上第一代zen2的,说好了不换 X570主板的。但老顽童一样没做到!首发买了块 3700X尝鲜,在B450-F上试过总体还可以,但也出现闪退、蓝屏的一些小问题。所以总觉得 B450搭 zen2g还是差点意思,这不,退了单U,换了X570-E+37X的板U套, 东西到齐后首先在原 Win10-1809的系统盘下测试,Bios原版本是0416?自刷 0804.发现 X570-E确实综合表现比 B450-F强一点点。跑分有小幅提升,而且跑游戏至今未出现过闪退等问题。 对比 Bios,可以发现 X570-E 开放的选项比 B450-F多一些,貌似至少提供三种超CPU的方式:第一页华硕自己的 performace enhance(相当于自己修改的XFR2),PBO,藏得较深的 Advanced里的 PBO、PB2、XFR。这几种方式按一些能找到的资料来看,确实有所不同,触发机制也不同。我也分别尝试了一下,效果都不明显。目前看,在此板上,还是在超频第一页按 performance enhance 模式,设到level 2 或level3 得出的分数稍高。(类似“管家”赵老师提出的XFR方案)PB2里开放所有电压、电流、功耗限制,得不到更好的成绩,但无论待机还是烤机,功耗都增加了几十瓦,非常不建议。内存方面,不开DOCP自设时序可能开不了机。要开了DOCP后,手动选更高的频率,flck 1866可稳。但1900下至少我的某船的条子稳不了1:1稳定测试。另外,要吐一下华硕的“optimem"技术,在EZ mode下可以找到,很保守。比起微星的 memery try it!差远了!,大饼哥要加油哦! 最后,都说”刷最新Bios,新装1903“能发挥 zen2最大性能。嘿嘿,就说下1903吧,不见得!我用原 2600X时的 1809系统盘测出的成绩,在各种相同设置下,都比新装的1903(编号18362.264)的分数高,C20,C15的成绩都差百分之多! 最后摆一下我遇到的一些小”灵异“事件:1.USB键鼠插靠近flashback按钮旁边的USB口开机不亮屏,换插至2.5G网卡口下边两个USB口成功亮屏正常开机。2.Bios中鼠标移动缓慢,根本没法用,好在自己习惯用键盘设置。3.X570的外频貌似不灵。开到102外频时,机械硬盘会掉盘。 用X570-E的朋友大家一起聊哈啦
新上zen2的朋友多测下稳定性 昨天3700X才到,目前大家大部分都是PBO自动睿频,我也实测锁4.3甚至4.4固定电压,是个出力不讨好的事,或超不上去,或效能还不如PBO官超。那只有在内存上动动了,然后就没其他可玩了。但使用的这一天半下来,感觉系统稳定性还不行,比如我遇到两次玩尘埃3闪退甚至蓝屏的情况,两三次冷启后无法开机。其中有板子的原因,我用B450-F,2406的Bios,感觉这Bios也不太稳定,冷启动有时开不了机。试回刷前一版Bios告诉你不给刷。但可以在2406上再刷一遍2406,想到林大说的一些话,觉得跟CPU内置南桥、Bios容量等等都有关,很有可能一次刷Bios,“数据未完全导入”。(加引号表示自己的理解)。再有可能就是内存,总想收下时序呀,提高点频率呀,但其实我们首先应在单开XMP的情况下(甚至在更低内存频率下),看看新系统在XMP参数下能不能稳定先!第三个锅给3700X?肯定会有人喷我,算了,且不论3700X,再就是系统的安装。我忙着尝鲜呢,**校长还不给放暑假,所以直接用2600X用过的1809系统,只是更新了AMD的芯片组驱动。都说1903实现了对3000系die的调用功能,等过两天放暑假了再重装系统看看。总之目前我的试用体会是,一般轻载完全没问题了,稳得很,但游戏、工作重载情况下,新的zen2系统稳定性尚待提高。
2700X的今天,就是3900X(3950?)的明天,顺聊厂家的产品布局 先扯个淡: 小时候,有个玩伴叫春来,大家玩打仗的时候,小伙伴们大多拿个小棍就当枪了,但春来偏要拿出他老子给他找的几段暖气水管和弯头,就开始在那捣鼓他的神级德国卡宾枪!结果,往往小伙伴们都已经“攻城略地”玩了好几轮了,可这小子的卡宾枪要么是不顺手,要么是还没做好,总之,我们一直在High,而春来一直在“痛并快乐着” 为啥扯这些?是想说,电脑玩家里也有这样两种人,一种人,厂家叫 enduser,指一般玩家,买对的产品,电脑就是个工具,用就是了,使用过程中感受着各种high;另一种人,极端玩家(我不是指那些科技UP,他们吃就吃这碗饭,我指的是用户,其实真实生活中你能看到的比率绝对没有吧里看到的那么多),板、U、显卡等等,一定要买到首发最高的顶极旗舰,然后呢?这里面当然有很多老手和高手,买这些产品往往是为了证明自己有强悍的驾驭能力,或者为了秀给别人看更高的分数。如果你真的问他“你这平台的实际体验怎么样?“他忍着肚子痛,都会告诉你一个字”爽!“,但这个爽字里面有多少酸或苦,只有他心里明白。因为这些旗舰需要更苛刻的条件才能稳定运行,而想进一步压榨更多的性能表现,要付出巨大、昂贵的代价!某网游场景:小白羡慕地问”大哥,您刚才又吊打我一顿,你这么高端的配置,平时干个活,打个游戏,不是爽到飞起?“不用急,你可能得不到大佬的即时回复。因为他吊打你一顿后又去重启,去折腾了。当然,我绝没有贬低后者的意思,大家购买电脑的目的千差万别,有些人折腾才是真正目的,无可厚非,但接下来我就是要讲一下,对于更一般的普通用户,购机目的是为了稳定地用爽,玩爽,要注意什么? 前几天,有人惊呼:2700X集体下架了?!是的,曾经zen+系列的旗舰标杆,被他亲娘活活掐死的!点解哩?因为新产品上市,曾经的标杆不符合厂家的定价布局了。其实邻家的99K也好不到哪去,他的掘墓人,已经在路上了。而且”intel真要凉了“,这话也说得太早,明年,后年,蓝色巨人还会用10代U和PCIe5.0,“弹一个响指”。。。这就是市场铁律!那么大家冷静地分析一下,基本可以断言,3900X,很可能是锐龙里面最短命的一个。。。 小白上来就呸我一脸带血的吐沫:“又来装大佬!那我该买啥?”我确实不是大佬,只是个从90年代就自己 Diy的一个普通玩家,摸的东西比较多一些,见的东西比较多一些罢了,我想对普通电脑用户给个建议-----新品迭代,别买最高端的旗舰,喜欢折腾的玩家,买次旗舰就好,既有超头,有玩头,又好用,价格也更新民一些;一般用户,选次舰,或新品垫底那款就好。这块才是厂家销量的保障,也是厂家最照顾,最用心的一块。其保值空间也最大。 我怎么买电脑产品?zen+时我买2600X配华硕 strix B450-E,intel 九代我买的是 97K配微星 z390 ACE,zen2上市,我订了 3700X,会先在自己的B450和另一块 X470 sli上试,达到预期目的,那就这么着。如果稍有不足,我会再等俩月,或换华擎 x570太极,或继续等甜品 B550. 以上纯个人观点,不喜勿喷,也欢迎大家讨论。
通过分析bios推测Zen2的新特性 在TechPowerup站上看到一篇新文章,转来大家看看。E文的,不自作多情帮翻译了,以保证原贴意思。 AMD will launch its 3rd generation Ryzen 3000 Socket AM4 desktop processors in 2019, with a product unveiling expected mid-year, likely on the sidelines of Computex 2019. AMD is keeping its promise of making these chips backwards compatible with existing Socket AM4 motherboards. To that effect, motherboard vendors such as ASUS and MSI began rolling out BIOS updates with AGESA-Combo 0.0.7.x microcode, which adds initial support for the platform to run and validate engineering samples of the upcoming "Zen 2" chips. At CES 2019, AMD unveiled more technical details and a prototype of a 3rd generation Ryzen socket AM4 processor. The company confirmed that it will implement a multi-chip module (MCM) design even for their mainstream-desktop processor, in which it will use one or two 7 nm "Zen 2" CPU core chiplets, which talk to a 14 nm I/O controller die over Infinity Fabric. The two biggest components of the IO die are the PCI-Express root complex, and the all-important dual-channel DDR4 memory controller. We bring you never before reported details of this memory controller.AMD has two big reasons to take the MCM route for even its mainstream desktop platform. The first is that it lets them mix-and-match silicon production technologies. AMD bean-counters reckon that it's more economical to build only those components on a shrunk 7 nanometer production process, which can benefit from the shrink; namely the CPU cores. Other components like the memory controller can continue to be built on existing 14 nm technologies, which by now are highly mature (= cost-efficient). AMD is also competing with other companies for its share of 7 nanometer allocation at TSMC. The 14 nm I/O controller die could, in theory, be sourced from GlobalFoundries to honor the wafer-supply agreement. The second big reason is the economics of downscaling. AMD is expected to increase CPU core counts beyond 8 and cramming 12-16 cores on a single 7 nm slab will make carving out cheaper SKUs by disabling cores costly, because AMD isn't always harvesting dies with faulty cores. These mid-range SKUs sell in higher volumes, and beyond a point AMD is forced to disable perfectly functional cores. It makes more sense to build 8-core or 6-core chiplets, and on SKUs with 8 cores or fewer, physically deploy only one chiplet. This way AMD is maximizing its utilization of precious 7 nm wafers.The downside of this approach is the memory controller is no longer physically integrated with the processor cores. The 3rd generation Ryzen processor (and all other Zen 2 CPUs), hence have an "integrated-discrete" memory controller. The memory controller is physically located inside the processor, but is not on the same piece of silicon as the CPU cores. AMD isn't the first to come up with such a contraption. Intel's 1st generation Core "Clarkdale" processor took a similar route, with CPU cores on a 32 nm die, and the memory controller plus an integrated GPU on a separate 45 nm die. Intel used its Quick Path Interconnect (QPI), which was cutting-edge at the time. AMD is tapping into Infinity Fabric, its latest high-bandwidth scalable interconnect that's heavily implemented on "Zen" and "Vega" product lines. We have learned that with "Matisse," AMD will be introducing a new version of Infinity Fabric that offers twice the bandwidth compared to the first generation, or up to 100 GB/s. AMD needs this because a single I/O controller die must now interface with up to two 8-core CPU dies, and up to 64 cores in their "EPYC" server line SKU. Our resident Ryzen Memory Guru Yuri "1usmus" Bubliy took a really close look at one of these BIOS updates with AGESA 0.0.7.x and found several new controls and options that will be exclusive to "Matisse," and possibly the next-generation Ryzen Threadripper processors. AMD has changed the CBS section title from "Zen Common Options" to "Valhalla Common Options." We have seen this codename on the web quite a bit over the past few days, associated with "Zen 2." We have learned that "Valhalla" could be the codename of the platform consisting of a 3rd generation Ryzen "Matisse" AM4 processor and its companion AMD 500-series chipset based motherboard, specifically the successor to X470 which is being developed in-house by AMD as opposed to sourcing from ASMedia. When doing serious memory overclocking, it can happen that the Infinity Fabric can't handle the increased memory speed. Remember, Infinity Fabric runs at a frequency synchronized to memory. For example, with DDR-3200 memory (which runs at 1600 MHz), Infinity Fabric will operate at 1600 MHz. This is the default of Zen, Zen+ and also Zen 2. Unlike earlier generations, the new BIOS offers UCLK options for "Auto", "UCLK==MEMCLK" and "UCLK==MEMCLK/2". The last option is new and will come in handy when overclocking your memory, to achieve stability, but at the cost of some Infinity Fabric bandwidth. Precision Boost Overdrive will receive more fine-grained control at the BIOS level, and AMD is making significant changes to this feature to make the boost setting more flexible and improve the algorithm. Early adopters of AGESA Combo 0.0.7.x on AMD 400-series chipset motherboards noticed that PBO broke or became buggy on their machines. This is because of poor integration of the new PBO algorithm with the existing one compatible with "Pinnacle Ridge." AMD also implemented "Core Watchdog", a feature that resets the system in case address or data errors destabilize the machine. The "Matisse" processor will also provide users with finer control over active cores. Since the AM4 package has two 8-core chiplets, you will have the option to disable an entire chiplet, or adjust the core-count in decrements of 2, since each 8-core chiplet consists of two 4-core CCX (compute complexes), much like existing AMD designs. At the chiplet-level you can dial down core counts from 4+4 to 3+3, 2+2, and 1+1, but never asymmetrically, such as 4+0 (which was possible on first-generation Zen). AMD is synchronizing CCX core counts for optimal utilization of L3 cache and memory access. For the 64-core Threadripper that has eight 8-core chiplets, you will be able to disable chiplets as long as you have at least two chiplets enabled. CAKE, or "coherent AMD socket extender" received an additional setting, namely "CAKE CRC performance Bounds". AMD is implementing IFOP (Infinity Fabric On Package,) or the non-socketed version of IF, in three places on the "Matisse" MCM. The I/O controller die has 100 GB/s IFOP links to each of the two 8-core chiplets, and another 100 GB/s IFOP link connects the two chiplets to each other. For multi-socket implementations of "Zen 2," AMD will provide NUMA node controls, namely "NUMA nodes per socket," with options including "NPS0", "NPS1", "NPS2", "NPS4" and "Auto". With "Zen 2," AMD is introducing a couple of major new DCT-level features. The first one is called "DRAM Map Inversion," with options including "Disabled", "Enabled" and "Auto". The motherboard vendor description of this option goes like "Properly utilize the parallelism within a channel and DRAM device. Bits that flip more frequently should be used to map resources of greater parallelism within the system." Another is "DRAM Post Package Repair," with options including "Enabled", "Disabled", and "Auto." This new special mode (which is a JEDEC standard) lets the memory manufacturer increase DRAM yields by selectively disabling bad memory cells, to replace them automatically with working ones from a spare area, similar to how storage devices map out bad sectors. We're not sure why such a feature is being exposed to end-users, especially from the client-segment. Perhaps it will be removed on production motherboards. We've also come across an interesting option related to the I/O controller that lets you select PCI-Express generation up to "Gen 4.0". This could indicate some existing 400-series chipset motherboards could receive PCI-Express Gen 4.0, given that we're examining a 400-series chipset motherboard's firmware. We've heard through credible sources that AMD's PCIe Gen 4.0 implementation involves the use of external re-driver devices on the motherboard. These don't come cheap. Texas Instruments sells Gen 3.0 redrivers for $1.5 a piece in 1,000-unit reel quantities. Motherboard vendors will have to fork out quite at least $15-20 on socket AM4 motherboards with Gen 4.0 slots, given that you need 20 of these redrivers, one per lane. We've come across several other common controls, including "RCD Parity" and "Memory MBIST" (a new memory self-test program). One of the firmware setup program pages is titled "SoC Miscellaneous Control," and includes the following settings, many of which are industry-standard: DRAM Address Command Parity Retry Max Parity Error Replay Write CRC Enable DRAM Write CRC Enable and Retry Limit Max Write CRC Error Replay Disable Memory Error Injection DRAM UECC Retry ACPI Settings: o ACPI SRAT L3 Cache As NUMA Domain o ACPI SLIT Distance Control o ACPI SLIT remote relative distance o ACPI SLIT virtual distance o ACPI SLIT same socket distance o ACPI SLIT remote socket distance o ACPI SLIT local SLink distance o ACPI SLIT remote SLink distance o ACPI SLIT local inter-SLink distance o ACPI SLIT remote inter-SLink distance CLDO_VDDP Control Efficiency Mode Package Power Limit Control DF C-states Fixed SOC P-state CPPC 4-link xGMI max speed 3-link xGMI max speed All in all, AMD Ryzen "Matisse" promises to give advanced and enthusiast users a treasure-chest of tuning options. 所以之前看到华硕、微星相应主板升级的新Bios,正在使用Zen+的朋友应该稍安勿躁,这新Bios跟咱没关系,上文说到Zen2的PBO有新的思维逻辑,说不定你升了新Bios还会对现在自动睿得好好的系统造成莫名的错误。另一个看懂的地方就是升PCIe 4.0这个美妙的传说,此文中提到必须增加实实在在的硬件成本。所以到底400系能不能按期品尝到这个甜品?我觉得也不好说。
Diyer的悲哀,玩无可玩。 Diy时代真的过去了,随着越来越多的东西被集成到CPU里,主板上的同质化越来越严重。哪怕两大阵营,X470,Z390除了CPU接口不同,其它地方已经没什么不同了。俺从奔腾时代玩各种板子,在那个真正的Diy时代,各家板厂真的是各显其能,各芯片组特性就有很大不同,而板厂又在总规范下加入更多好玩好用的功能或扩展。所以俺一度特别迷恋收集各家主板(因为那时实体店发展好,各地的电脑城门庭若市,非常热闹,所以自己常去电脑城玩,认识了很多卖家,所以常常可以从这些卖家那里借板卡回家玩)拿来比对,测试,把玩。一块U,一根条子,在不同板子上的表现竟然天差地别!海洋、QDI、大众、Aopen、硕泰克、梅捷、磐正、精英、DFI、Abit升技、微星、技嘉、华硕这些主板厂商都曾经辉煌过,也都曾有过很经典的主板享誉一时。 再看看现在,猿说得没错,这个世界上只有两种主板,一种叫Rog,另一种叫其他主板。 看看这两年的主板,除外观(我不喜欢光污染,这种哗众取宠的杀马特东西迟早会被人们唾弃),可聊的东西都有什么?第一、供电,看看国外超频网的大神发布四大主板厂的供电清单,然后各厂的粉丝们或欢呼雀跃,或扼腕叹息,或互相撕B,互相不服。然后小白们仍然一个劲地问,可不可以上某嘉的B450?第二、Bios,你家防掉压做到了8级,我家却一直没有防掉压?你家有offset,我家为啥只能调固定值?而且是只能调两位小数?你家内存可以上到3466,我家为啥连2999都难?Rog 的Bios功能强大,某凄惨的板子却从出厂就不再更新?但玩Rog的玩家,有几位动过所有的选项,并且知道那种选项的真实作用?我看一般除了调内存时序,你动Rog选项差不多都不会超过10个选项!第三、玩内存,增带宽,降延迟,比分数。你使劲跑Remtest然后拿出超5W5的跑分就是个秀!吓我呢?有用吗?同极 Intel平台随便找一个3200以上的默频跑出来都让你羞羞。。。。 还有啥玩的?真是,配了一台高性能主机,摸一摸底,调一调,测一下,烤烤机,看看管家的视频,有收获,说人家真棒!不得要领,说人家装B;看林大视频,恨不得把Godlike拆下来,今晚让我抱着你。。。。。亲亲。。。。 再然后呢?“哥,吃鸡呀!”“别!人老眼花,2600X+588,刚降落连个撸子都没有就被人家爆头了。。。。” “哥,玩LOL呀!”“中年油腻大叔,撸不动喽。。。。”
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